S130 SoftDevice v1.0.0
Data Fields
ble_gap_sec_kdist_t Struct Reference

Keys that can be exchanged during a bonding procedure. More...

#include <ble_gap.h>

Data Fields

uint8_t enc: 1
 
uint8_t id: 1
 
uint8_t sign: 1
 

Detailed Description

Keys that can be exchanged during a bonding procedure.

Field Documentation

uint8_t ble_gap_sec_kdist_t::enc

Long Term Key and Master Identification.

uint8_t ble_gap_sec_kdist_t::id

Identity Resolving Key and Identity Address Information.

uint8_t ble_gap_sec_kdist_t::sign

Connection Signature Resolving Key.


This document was last updated on Mon Nov 9 2015.
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