The operating conditions are the physical parameters that the chip can operate within.
| Symbol | Parameter | Min. | Nom. | Max. | Units |
|---|---|---|---|---|---|
| VDD | VDD supply voltage, independent of DCDC enable | 1.7 | 3.0 | 3.6 | V |
| VDDH | VDDH supply voltage, independent of DCDC enable | 2.5 | 3.7 | 5.5 | V |
| VBUS | VBUS USB supply voltage | 4.35 | 5.0 | 5.5 | V |
| TA | Operating temperature | -40 | 25 | 105 | °C |
All WLCSP package variants are sensitive to visible and close-range infrared light. This means that a final product design must shield the chip properly, either by final product encapsulation or by shielding/coating of the WLCSP device.
Some WLCSP package variants have a backside coating, where the marking side of the device is covered with a light absorbing film, while the side edges and the ball side of the device are still exposed and need to be protected. Other WLCSP package variants do not have any such protection.
The WLCSP package variant CLAA has a backside coating.