Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the IC can be found below.

Table 1. Package thermal characteristics
Symbol Package Typ. Unit
θJA,aQFN94 aQFN94 20.74 °C/W
θJB,aQFN94 aQFN94 8.10 °C/W
θJC,aQFN94 aQFN94 8.75 °C/W
θJA,WLCSP WLCSP 28.51 °C/W
θJB,WLCSP WLCSP 8.73 °C/W
θJC,WLCSP WLCSP 4.04 °C/W

Values obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.

Parent topic: nRF5340 Product Specification
This document was last updated on 2023-12-04.
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