Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the IC can be found below.

Table 1. Package thermal characteristics
Symbol Package Typ. Unit
θJA,aQFN73 aQFN73 24.11 °C/W
θJA,QFN48 QFN48 22.37 °C/W
θJA,WLCSP WLCSP 36.55 °C/W

Values obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.