A summary of the thermal characteristics for the different packages available for the IC can be found below.
Symbol | Package | Typ. | Unit |
---|---|---|---|
θJA,aQFN73 | aQFN73 | 24.11 | °C/W |
θJA,QFN48 | QFN48 | 22.37 | °C/W |
θJA,WLCSP | WLCSP | 36.55 | °C/W |
Values obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.