The operating conditions are the physical parameters that the chip can operate within.
Symbol | Parameter | Min. | Nom. | Max. | Units |
---|---|---|---|---|---|
VDD | VDD supply voltage, independent of DCDC enable | 1.7 | 3.0 | 3.6 | V |
VDDPOR | VDD supply voltage needed during power-on reset | 1.75 | V | ||
VDDH | VDDH supply voltage | 2.5 | 3.7 | 5.5 | V |
VBUS | VBUS USB supply voltage | 4.35 | 5.0 | 5.5 | V |
tR_VDD | Supply rise time (0 V to 1.7 V) | 60 | ms | ||
tR_VDDH | Supply rise time (0 V to 3.7 V) | 100 | ms | ||
TA | Operating temperature | -40 | 25 | 85 | °C |
TAEXT | Extended operating temperature | 85 | 105 | °C | |
TJ | Junction temperature | 110 | °C |
The operating temperature range for the device is defined in Recommended operating conditions.
The range extends from TA
minimum to TAEXT
maximum.
Some electrical parameters are valid only for the TA
operating temperature conditions.
When this is the case, an additional parameter for the TAEXT
extended operating temperature condition is provided.
Extended
.
To avoid surpassing the maximum die juntion temperature, see Recommended operating conditions, it is important to minimize current consumption when operating in the extended operating temperature conditions. To achieve this, it is recommended to use the device in Normal Voltage mode with DC/DC enabled. See POWER — Power supply for details about main supply modes.
All WLCSP package variants are sensitive to visible and close-range infrared light. This means that a final product design must shield the chip properly, either by final product encapsulation or by shielding/coating of the WLCSP device.
Some WLCSP package variants have a backside coating, where the marking side of the device is covered with a light absorbing film, while the side edges and the ball side of the device are still exposed and need to be protected. Other WLCSP package variants do not have any such protection.
The WLCSP package variant CJAA has a backside coating.