The operating conditions are the physical parameters that the chip can operate within.
Symbol | Parameter | Min. | Nom. | Max. | Unit |
---|---|---|---|---|---|
VIN | Supply voltage VIN, VIN_ANA, VIN_BUCK0, VIN_BUCK1, VIN_BUCK2, VIN_BUCK3, VIN_LDO0, VIN_LDO1, VIN_GPIO The voltage levels for above pins must be within 100 mV from each other (including transients) |
3.0 | 5.5 | V | |
VO0_IN | nINT and READY supply voltage | 1.71 | 3.6 | V | |
VDD_TWI |
TWI supply voltage VDD_TWI ≤ VIN |
1.65 | 3.6 | V | |
VO2 |
Supply voltage, custom configuration (BUCK2 unpopulated) VO2 ≤ VDD_TWI |
1.14 | 3.6 | V | |
VINRAMP | VIN supply ramp rate (RSOURCE < 0.5 Ohm) | 1 | V/ms | ||
TJ | Junction temperature | −40 | 25 | 125 | °C |
TOJ | Operating junction temperature | −40 | 25 | 105 | °C |
Pin | Parameter | Min. | Nom. | Max. | Unit |
---|---|---|---|---|---|
ENABLE | 0 | VIN | V | ||
GPIO0, GPIO1, GPIO2 | CMOS mode | 0 | VIN | V | |
Schmitt trigger mode | 0 | VO2 | |||
BUCK_MODE0, BUCK_MODE1, BUCK_MODE2 | CMOS mode | 0 | VIN | V | |
Schmitt trigger mode | 0 | VO2 | |||
READY, nINT | 0 | VO0 | V | ||
SCL, SDA | 0 | VDD_TWI | V |
Symbol | Parameter | Nom. | Unit |
---|---|---|---|
RϴJA | Junction-to-ambient thermal resistance | 42 | °C/W |
RϴJC(top) | Junction-to-case (top) thermal resistance | 2 | °C/W |
RϴJB | Junction-to-board thermal resistance | 15.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 3.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 16 | °C/W |
WLCSP package is sensitive to visible and near infrared light, which means that a final product design must shield the chip properly.