Recommended operating conditions

The operating conditions are the physical parameters that the chip can operate within.

Table 1. Recommended operating conditions
Symbol	Description	Min.	Max	Unit
VBUS_OP	Supply voltage	4.0	5.5	V
VBAT_OP	Battery voltage	2.3	4.45	V
VDDIO	I/O supply voltage	1.7	VSYS	V
T_J	Junction temperature	-40	+125	°C
T_A	Ambient temperature	-40	+85	°C

Note: Any system features powered by VSYS will only operate when the VSYS voltage > VSYS_POF.

Dissipation ratings

Thermal resistances and thermal characterization parameters as defined by JESD51-7 are shown in the following tables.

Table 2. QFN32 thermal resistance and characterization parameters
Symbol	Parameter	QFN 32 pins	Units
R_ϴJA	Junction-to-ambient thermal resistance	24.2	°C/W
R_ϴJC(top)	Junction-to-case (top) thermal resistance	10.7	°C/W
R_ϴJB	Junction-to-board thermal resistance	8.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.15	°C/W
Ψ_JB	Junction-to-board characterization parameter	8.9	°C/W

Table 3. WLCSP thermal resistance and characterization parameters
Symbol	Parameter	WLCSP 35 pins	Units
R_ϴJA	Junction-to-ambient thermal resistance	48.3	°C/W
R_ϴJC(top)	Junction-to-case (top) thermal resistance	6.0	°C/W
R_ϴJB	Junction-to-board thermal resistance	23.0	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	23.4	°C/W

WLCSP light sensitivity

WLCSP package is sensitive to light.

All WLCSP package variants are sensitive to visible and close-range infrared light. The final product design must shield the chip through encapsulation or shielding/coating the WLCSP device.

WLCSP package variant CAAA has a backside coating that covers the marking side of the device with a light absorbing film. The side edges and the ball side of the device are still exposed and need to be protected.