The operating conditions are the physical parameters that the chip can operate within.
Symbol | Parameter | Notes | Min. | Nom. | Max. | Unit |
---|---|---|---|---|---|---|
VBUSOP | Supply voltage | 4.1 | 5 | 6.7 | V | |
VBATOP | Battery voltage | 2.30 | 4.35 | V | ||
TJ | Junction temperature | -40 | +125 | °C | ||
TO | Operating temperature | Ambient | -40 | +85 | °C |
Thermal resistances and thermal characterization parameters as defined by JESD51-7 are shown in the following table.
Symbol | Parameter | WLCSP 25 pins | Units |
---|---|---|---|
RϴJA | Junction-to-ambient thermal resistance | 50.7 | °C/W |
RϴJC(top) | Junction-to-case (top) thermal resistance | 9.2 | °C/W |
RϴJB | Junction-to-board thermal resistance | 22.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 1.05 | °C/W |
ΨJB | Junction-to-board characterization parameter | 23 | °C/W |
Symbol | Parameter | QFN 24 pins | Units |
---|---|---|---|
RϴJA | Junction-to-ambient thermal resistance | 33.5 | °C/W |
RϴJC(top) | Junction-to-case (top) thermal resistance | 16.1 | °C/W |
RϴJB | Junction-to-board thermal resistance | 14.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.25 | °C/W |
ΨJB | Junction-to-board characterization parameter | 14.1 | °C/W |
WLCSP package is sensitive to visible and near infrared light, which means that a final product design must shield the chip properly.