The glossary contains terms and acronyms that are used in this document.
DC
Direct Current
Electromagnetic Interference (EMI)
Electromagnetic noise or energy that causes disturbance and unwanted effects that
interfere with the operation of an electrical circuit.
EMI
Evaluation Kit (EK)
A platform used to evaluate different development platforms.
EK
Li-ion
Lithium-ion
Lithium-polymer (Li-Poly)
A rechargeable battery of lithium-ion technology using a polymer electrolyte instead
of a liquid electrolyte.
Li-Poly
Low-Dropout Regulator (LDO)
A linear voltage regulator that can operate even when the supply voltage is very close
to the desired output voltage.
LDO
Power Management Integrated Circuit (PMIC)
A chip used for various functions related to power management.
PMIC
Printed Circuit Board (PCB)
A board that connects electronic components.
PCB
Pulse Width Modulation (PWM)
A form of modulation used to represent an analog signal with a binary signal where the
switching frequency is fixed, and all the pulses corresponding to one sample are contiguous
in the digital signal.
PWM
Quad Flat No-lead Package (QFN)
A near chip scale package with pads on four sides encapsulated in plastic.
QFN
System on Chip (SoC)
A microchip that integrates all the necessary electronic circuits and components of a
computer or other electronic systems on a single integrated circuit.
SoC
Two-wire Interface (TWI)
An I2C compatible serial communication protocol that enables devices to
exchange data by using a two-wire bus system, allowing multiple devices to be connected and
controlled by a master device.
TWI
Universal Serial Bus (USB)
An industry standard that establishes specifications for cables and connectors and
protocols for connection, communication, and power supply between computers, peripheral devices,
and other computers.
USB
Wafer Level Chip Scale Package (WLCSP)
Die size package with an array pattern of solder balls at a pitch that is compatible
with circuit board assembly process.