Good thermal design on the application board is essential for maximizing the performance and battery life of nRF9160. Poor thermal design causes nRF9160's built-in thermal protection to more easily trigger, preventing nRF9160 from transmitting and receiving LTE and Global Positioning System (GPS) data.
The maximum power consumption and operating temperature of nRF9160 and the JEDEC standardized thermal coefficients are shown in the following table.
Parameter | Value |
---|---|
Power consumption (maximum heat power dissipation) | 1480 mW |
Maximum operating temperature | 85°C |
RthetaJA (Module-to-Ambient) | 23°C/W |
RThetaJB (Module-to-Board) | 6°C/W |
RThetaJC (Module-to-Case) | 1°C/W |
Maximum allowed Tc (Module case temperature) | 85°C |
Maximum Allowed Tj (Worst case of module components) | 85°C |