Advanced Quad Flat No-lead (aQFN™) is a leadless, multi-row, fine pitch lead frame packaging solution. With a low profile and small footprint, aQFN is a light weight, free-form I/O design which lends itself to enhanced thermal and electrical performance. The aQFN package has a significant cost benefit due to its economical materials and simpler packaging process.
The following mechanical specifications show the dimensions of the aQFN73™ 7 x 7 mm package in millimeters:
Figure 1. aQFN73 7 x 7 mm package
| A | A1 | A2 | A3 | b | D, E | D2, E2 | e | e1 | e2 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Min. | 0.02 | 0.20 | 4.75 | |||||||
| Nom. | 0.05 | 0.675 | 0.13 | 0.25 | 7.00 | 4.85 | 0.5 | 2.75 | 0.559 | |
| Max. | 0.85 | 0.08 | 0.30 | 4.95 |