This chapter shows the recommended dimensions for the component's footprint. To ensure a good electrical connection and solderability of the aQFN73™ package, use the included land pattern design.
The following figure illustrates the PCB land pad design and dimensions in millimeters:
Figure 1. PCB land pad design
The following figure illustrates the PCB thermal pad design and dimensions in millimeters:
Figure 2. PCB thermal pad design
The following table includes the dimensions of the PCB land pad design:
| PCB land pad design | Dimension (mm) |
|---|---|
| Copper pad diameter | 0.275 |
| Solder mask | 0.375 |
| Paste mask opening | 0.3 |
| Stencil thickness | 0.1 |
| Exposed die pad size | 4.85 |
| Exposed die pad via diameter | 0.3 |
| Exposed die pad via pitch | 1.2 |
The following figure shows the top view of the aQFN73 footprint with the pads organized in a 250µm grid. The figure illustrates the copper pads (red), solder mask (purple), paste mask (grey), exposed die pad via holes (gray and brown), and package outline (black).
Figure 3. aQFN73 footprint with 250 µm
grid
