This example requires one of the following SoftDevices: S130, S132

Important: Before you run this example, make sure to program the SoftDevice.

The Bond Management Application is an example that demonstrates how to use the Bond Management Service. The example shows how to manage the storage of bond information and how to delete bonds after they have been established.

Note: This application is not power optimized!

The application includes one service:

Bond Management Service

Setup

You can find the source code and the project file of the example in the following folder: <InstallFolder>\examples\ble_peripheral\experimental_ble_app_bms

Testing

Test the Bond Management Application with the nRF Toolbox app, which is available on both iOS (App Store) and Android (Google Play).

You can also test the application with the Master Control Panel by performing the following steps:

Compile and program the application. Observe that the BSP_INDICATE_ADVERTISING state is indicated.
Connect to the device from Master Control Panel (the device will be advertising as 'Nordic_BMS').
Bond with the device.
Perform service discovery. Observe that the BSP_INDICATE_CONNECTED state is indicated.
Disconnect from the device and connect again. Observe that the devices are still bonded, thus link encryption is ON.
Observe that the Feature Characteristic (0x2AA5) of the Bond Management Service (0x181E) displays 20-08-02. This means that the following is supported: Deletion of the bonds for the current connection, deletion of all bonds, and deleting all but the requesting device's bond.
Write 03-41-42-43-44 (03 is the command to delete the current bond, followed by the authorization code ABCD) to the Bond Management Service Control Point Characteristic (0x2AA4).
Disconnect from the device to trigger the bond deletion procedures.
Observe that the BSP_INDICATE_ADVERTISING state is indicated.
Connect to the device again and observe that the pairing request fails.